公开(公告)号：US08564317B2

公开(公告)日：2013-10-22

申请号：US12719267

申请日：2010-03-08

申请人： Jong-Won Han ,  Seok Goh ,  Byoung-Jun Min ,  Jung-Hyeon Kim ,  Sang-Sik Lee ,  Bo-Woo Kim ,  Ho-Jeong Choi

发明人： Jong-Won Han ,  Seok Goh ,  Byoung-Jun Min ,  Jung-Hyeon Kim ,  Sang-Sik Lee ,  Bo-Woo Kim ,  Ho-Jeong Choi

IPC分类号： G01R31/00

CPC分类号： G01R1/0458 ,  G01R31/2863 ,  G01R31/2875

摘要： A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

摘要翻译： 提供了一种测试插座，其包括用于接收被测试对象的插座主体，设置在插座主体上的盖子，一个或多个连接到盖的第一表面的推动器，以向该插座的第一表面施加力 主体和温度控制构件以向对象提供温度。 可以在包括测试插座的测试设备中测试半导体封装，测试方法包括在测试室中的插座中接收半导体封装，将第一温度施加到测试室以在第一测试中测试半导体封装 温度，并且向半导体封装施加第二温度以通过控制第二温度与插座的应用来在第二测试温度下测试半导体封装。

公开(公告)号：US20090009204A1

公开(公告)日：2009-01-08

申请号：US12214932

申请日：2008-06-24

申请人： Sang-Sik Lee ,  Bo-Woo Kim ,  Ho-Jeong Choi

发明人： Sang-Sik Lee ,  Bo-Woo Kim ,  Ho-Jeong Choi

IPC分类号： G01R31/02

CPC分类号： G01R1/0458 ,  G01R31/2875

摘要： A test socket in accordance with one aspect of the present invention includes a socket body, a thermoelectric element and a heat transfer member. The socket body receives an object. The thermoelectric element is arranged in the socket body to emit heat and absorb heat in accordance with current directions. The heat transfer member is arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element. Thus, the object may be directly provided with a desired test temperature using the thermoelectric element so that the desired test temperature may be set rapidly and accurately. Further, the heat transfer member interposed between the object and the thermoelectric element may quickly dissipate the heat in the object.

摘要翻译： 根据本发明的一个方面的测试插座包括插座体，热电元件和传热构件。 插座主体接收一个对象。 热电元件布置在插座主体中以发射热量并根据电流方向吸收热量。 传热构件设置在物体和热电元件之间，以将从物体产生的热量传递到热电元件。 因此，可以使用热电元件将物体直接设置有期望的测试温度，使得可以快速且准确地设置期望的测试温度。 此外，介于物体和热电元件之间的传热构件可能会快速地散发物体中的热量。

公开(公告)号：US20090153171A1

公开(公告)日：2009-06-18

申请号：US12314360

申请日：2008-12-09

申请人： Sang-Sik Lee ,  Yun-Ha Park ,  Sung-Min Sim ,  Myoung-Sub Kim

发明人： Sang-Sik Lee ,  Yun-Ha Park ,  Sung-Min Sim ,  Myoung-Sub Kim

IPC分类号： G01R31/28

CPC分类号： G01R31/2874

摘要： An apparatus for testing objects includes a test board having electrical connection areas to connect to the objects, a chamber fixture located on the test board to form test chambers that are configured to individually receive the objects, a thermoelectric element provided to each test chamber to adjust the temperature of the object, and a temperature controller for individually controlling operations of the thermoelectric elements.

摘要翻译： 一种用于测试物体的装置包括具有连接到物体的电气连接区域的测试板，位于测试板上的腔室夹具，以形成被配置为分别接收物体的测试室，设置到每个测试室的热电元件以调整 物体的温度和用于单独控制热电元件的操作的温度控制器。