Invention Application
- Patent Title: HEAT TREATMENT APPARATUS
- Patent Title (中): 热处理设备
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Application No.: US12236014Application Date: 2008-09-23
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Publication No.: US20090013698A1Publication Date: 2009-01-15
- Inventor: Tae-gyu Kim , Dong-Woo Lee , Jin-Sung Lee , Tae-Sang Park , Bang-Weon Lee
- Applicant: Tae-gyu Kim , Dong-Woo Lee , Jin-Sung Lee , Tae-Sang Park , Bang-Weon Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR2004-45856 20040619
- Main IPC: F25D31/00
- IPC: F25D31/00

Abstract:
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
Information query
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