公开(公告)号：US08396407B2

公开(公告)日：2013-03-12

申请号：US12971304

申请日：2010-12-17

申请人： Jin Sung Lee

发明人： Jin Sung Lee

IPC分类号： G03G15/20

CPC分类号： G03G15/206 ,  G03G2215/2035

摘要： A fusing device to improve an amount of heat to a recording medium, and an image forming apparatus having the same, includes a heating unit having a heat source and a press roller arranged to come into contact with and to press an outer circumferential surface of the heating unit so as to define a fusing nip. The press roller includes an elastic layer and at least one heating element contained in the elastic layer to allow generation of heat from the interior of the elastic layer. The heating element may include heating particles dispersed in the elastic layer, or may be a sheet type heating element inserted in the elastic layer.

摘要翻译： 一种用于改善对记录介质的热量的定影装置，以及具有该定影装置的图像形成装置，包括具有热源和加压辊的加热单元，该加热单元布置成与 加热单元，以便限定定影辊隙。 压辊包括弹性层和包含在弹性层中的至少一个加热元件，以允许从弹性层的内部产生热量。 加热元件可以包括分散在弹性层中的加热颗粒，或者可以是插入弹性层中的片状加热元件。

公开(公告)号：US20100109065A1

公开(公告)日：2010-05-06

申请号：US12612125

申请日：2009-11-04

申请人： Jin-Yong Oh ,  Woonkyung Lee ,  Jin-Sung Lee ,  Sunil Shim ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang ,  Jin-Soo Lim

发明人： Jin-Yong Oh ,  Woonkyung Lee ,  Jin-Sung Lee ,  Sunil Shim ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang ,  Jin-Soo Lim

IPC分类号： H01L27/115

CPC分类号： H01L27/11578 ,  H01L27/0688 ,  H01L27/11565 ,  H01L27/11582

摘要： Nonvolatile memory devices are provided and methods of manufacturing such devices. In the method, conductive layers and insulating layers are alternatingly stacked on a substrate. A first sub-active bar is formed which penetrates a first subset of the conductive layers and a first subset of the insulating layers. The first sub-active bar is electrically connected with the substrate. A second sub-active bar is formed which penetrates a second subset of the conductive layers and a second subset of the insulating layers. The second sub-active bar is electrically connected to the first sub-active bar. A width of a bottom portion of the second sub-active bar is less than a width of a top portion of the second sub-active bar.

摘要翻译： 提供非易失性存储器件和制造这种器件的方法。 在该方法中，导电层和绝缘层交替堆叠在基板上。 形成第一子活动杆，其穿过导电层的第一子集和绝缘层的第一子集。 第一子活性棒与衬底电连接。 形成第二子活动杆，其穿透导电层的第二子集和绝缘层的第二子集。 第二子活动杆电连接到第一子活动杆。 第二副活性杆的底部的宽度小于第二副活性杆的顶部的宽度。

公开(公告)号：US20090315160A1

公开(公告)日：2009-12-24

申请号：US12486998

申请日：2009-06-18

申请人： Lei Wang ,  Jin-Sung Lee ,  Qian Wang ,  Zhenging Zhao

发明人： Lei Wang ,  Jin-Sung Lee ,  Qian Wang ,  Zhenging Zhao

IPC分类号： H01L23/495 ,  H01L21/60 ,  H05K7/04 ,  H01R43/00

CPC分类号： H01L23/49541 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2224/85947 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A prefabricated lead frame to bond a chip and a substrate, and a bonding method using the prefabricated lead frame. The prefabricated lead frame includes an inner ring, an outer ring, and a plurality of wires, wherein inner ends and outer ends of the wires are respectively connected to the inner ring and the outer ring, and the prefabricated lead frame has a wire shape corresponding to a chip and a substrate to be bonded. The prefabricated lead frame may be manufactured in batch production to increase the manufacturing efficiency of semiconductor devices, and the prefabricated lead frame may be used instead of a general wire bonding process.

摘要翻译： 用于结合芯片和基板的预制引线框架和使用预制引线框架的接合方法。 预制引线框架包括内环，外环和多根电线，其中电线的内端和外端分别连接到内环和外环，并且预制引线框架具有对应的线形状 连接到芯片和待接合的基板。 预制引线框架可以批量生产以提高半导体器件的制造效率，并且可以使用预制引线框架来代替通常的引线接合工艺。

公开(公告)号：US20090230457A1

公开(公告)日：2009-09-17

申请号：US12381380

申请日：2009-03-11

申请人： Jin-Sung Lee ,  Woon-Kyung Lee

发明人： Jin-Sung Lee ,  Woon-Kyung Lee

IPC分类号： H01L29/792 ,  H01L27/088 ,  H01L29/06

CPC分类号： H01L27/11521 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11534 ,  H01L27/11565 ,  H01L27/11568 ,  H01L27/11573

摘要： A semiconductor device includes a plurality of transistors disposed on a semiconductor substrate, a device isolation layer disposed around the transistors, a guard ring disposed to surround the device isolation layer and the transistors, and a guard region disposed between adjacent transistors.

摘要翻译： 半导体器件包括设置在半导体衬底上的多个晶体管，围绕晶体管设置的器件隔离层，设置成围绕器件隔离层和晶体管的保护环以及设置在相邻晶体管之间的保护区。

公开(公告)号：US20090013698A1

公开(公告)日：2009-01-15

申请号：US12236014

申请日：2008-09-23

申请人： Tae-gyu Kim ,  Dong-Woo Lee ,  Jin-Sung Lee ,  Tae-Sang Park ,  Bang-Weon Lee

发明人： Tae-gyu Kim ,  Dong-Woo Lee ,  Jin-Sung Lee ,  Tae-Sang Park ,  Bang-Weon Lee

IPC分类号： F25D31/00

CPC分类号： H01L21/67109 ,  B05B7/0441

摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。

公开(公告)号：US20070224347A1

公开(公告)日：2007-09-27

申请号：US11525026

申请日：2006-09-22

申请人： Jin Sung Lee ,  Tae Gyu Kim ,  June Mo Koo ,  Chang Hoon Jung

发明人： Jin Sung Lee ,  Tae Gyu Kim ,  June Mo Koo ,  Chang Hoon Jung

IPC分类号： B05C11/02 ,  B05B3/00 ,  B05D7/00 ,  B05D3/12

CPC分类号： H01L21/6715 ,  B05D1/005 ,  B05D1/02 ,  G03F7/162

摘要： A liquid coating apparatus and method for spraying a liquid on a wafer. The liquid coating apparatus may include a nozzle unit spraying the liquid on the wafer and moving relative to the wafer and a laminar flow forming unit forming a forced air flow around the nozzle unit. Though a wake may be formed around the nozzle unit by a movement of the nozzle unit, the laminar forming unit may reduce and/or minimize an influence of the wake.

摘要翻译： 一种用于将液体喷射在晶片上的液体涂覆装置和方法。 液体涂布装置可以包括将液体喷射在晶片上并相对于晶片移动的喷嘴单元和形成在喷嘴单元周围的强制空气流的层流形成单元。 虽然可以通过喷嘴单元的运动在喷嘴单元周围形成尾流，但是层流形成单元可以减少和/或最小化尾流的影响。

公开(公告)号：US20060151462A1

公开(公告)日：2006-07-13

申请号：US11318539

申请日：2005-12-28

申请人： Jin-sung Lee ,  Dong-woo Lee ,  Tae-gyu Kim ,  Tae-sang Park ,  Bang-weon Lee ,  Jong-kill Lim ,  Chang-hoon Jung ,  Sang-Kwon Wee

发明人： Jin-sung Lee ,  Dong-woo Lee ,  Tae-gyu Kim ,  Tae-sang Park ,  Bang-weon Lee ,  Jong-kill Lim ,  Chang-hoon Jung ,  Sang-Kwon Wee

IPC分类号： F27B5/14 ,  F26B19/00 ,  F27D11/00

CPC分类号： H01L21/67109 ,  F27B5/04 ,  F27B5/14 ,  F27B17/0025

摘要： A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

摘要翻译： 半导体晶片烘烤装置包括热板，上部开口的容器和覆盖容器的上部的盖。 该盖包括在其间形成气体循环空间的上板，下板和侧壁。 在侧壁中形成至少一个气体入口，在下板的中心区域形成有多个气体供给孔，并且在其上形成有排气单元的裙部联接到盖的下边缘。

公开(公告)号：US06992270B2

公开(公告)日：2006-01-31

申请号：US10924287

申请日：2004-08-23

申请人： Dong-Woo Lee ,  Jin-Sung Lee ,  Sang-Kap Kim ,  Dong-Hwa Shin ,  Tae-Gyu Kim

发明人： Dong-Woo Lee ,  Jin-Sung Lee ,  Sang-Kap Kim ,  Dong-Hwa Shin ,  Tae-Gyu Kim

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01L21/67248 ,  H01L21/67109

摘要： A wafer bake system includes a heating plate for heating a wafer, and means for supporting the wafer to be spaced from the heating plate, wherein a gap distribution between the wafer and the heating plate is measured, and a temperature gradient of the wafer is controlled based on the measured gap distribution.

摘要翻译： 晶片烘烤系统包括用于加热晶片的加热板和用于将晶片与加热板间隔开的装置，其中测量晶片和加热板之间的间隙分布，并且控制晶片的温度梯度 基于测量的间隙分布。

公开(公告)号：US5978490A

公开(公告)日：1999-11-02

申请号：US997885

申请日：1997-12-24

申请人： Hyun-Woo Choi ,  Jin-Sung Lee

发明人： Hyun-Woo Choi ,  Jin-Sung Lee

IPC分类号： H04R3/00

CPC分类号： H04R3/005 ,  H04R2201/403 ,  H04S2400/15

摘要： A directivity controlling apparatus and method of a microphone system for collecting audio signals in an audio recording/reproducing system. A certain microphone in the system is selected to have directivity according to a result of comparing levels of input signals supplied into plural partial microphones in a supervisory mode by categorizing directional microphones into a directional mode and the supervisory mode. An automatic shift operation is performed during the supervisory mode, in which audio signal levels received via the plural partial microphones are compared to select a certain microphone to have the specific directivity and, then, the input level of the particular microphone having the directivity is monitored to repeat the supervisory mode according to the monitored input level.

摘要翻译： 一种用于在音频记录/再现系统中收集音频信号的麦克风系统的方向性控制装置和方法。 选择系统中的某个麦克风具有根据通过将定向麦克风分类为定向模式和监视模式在监控模式中提供给多个部分麦克风的输入信号的电平的结果的方向性。 在监视模式期间执行自动移位操作，其中经由多个部分麦克风接收的音频信号电平被比较以选择某个麦克风以具有特定的方向性，并且然后监视具有指向性的特定麦克风的输入电平 根据监控的输入电平重复监控模式。

公开(公告)号：US08698879B2

公开(公告)日：2014-04-15

申请号：US13312149

申请日：2011-12-06

申请人： Jin-sung Lee ,  Ju-yong Chang ,  Jong-sul Min ,  Sung-jin Kim

发明人： Jin-sung Lee ,  Ju-yong Chang ,  Jong-sul Min ,  Sung-jin Kim

IPC分类号： H04N13/04

摘要： A three-dimensional (3D) display apparatus and method controlling thereof are provided. The 3D display apparatus includes: a reception unit which receives a 3D image signal from another 3D display apparatus; a conversion unit which converts a disparity of the 3D image signal based on transmitter information of the other 3D display apparatus and receiver information of the 3D display apparatus, and generates an output 3D image signal having depth information which is proportional to depth information of the 3D image signal; and a display unit which outputs the output 3D image signal.