发明申请
- 专利标题： Method for Gluing a Circuit Component to a Circuit Board
- 专利标题（中）： 将电路部件胶合到电路板的方法
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申请号： US10597232申请日： 2005-01-10
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公开(公告)号： US20090014120A1公开(公告)日： 2009-01-15
- 发明人: Willibald Konrath , Klaus Scholl , Haiko Schmelcher , Ulf Muller
- 申请人： Willibald Konrath , Klaus Scholl , Haiko Schmelcher , Ulf Muller
- 优先权： DE102004002274.7 20040116
- 国际申请： PCT/EP05/50084 WO 20050110
- 主分类号： B32B7/14
- IPC分类号： B32B7/14
摘要：
For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.
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