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    Automated circuit board assembly positioning system
    1.
    发明授权
    Automated circuit board assembly positioning system 有权
    自动化电路板组装定位系统

    公开(公告)号：US07486522B2

    公开(公告)日：2009-02-03

    申请号：US10502703

    申请日：2003-01-28

    申请人： Ulf Muller ,  Willibald Konrath ,  Klaus Scholl ,  Dieter Kienzle ,  Lothar Ubele

    发明人： Ulf Muller ,  Willibald Konrath ,  Klaus Scholl ,  Dieter Kienzle ,  Lothar Ubele

    IPC分类号： H05K1/14

    CPC分类号： H05K13/0061

    摘要： An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

    摘要翻译： 自动化电路板组装系统包括至少一个可移动电路板接收器，该可移动电路板接收器装备有空电路板或混合电路，该电路板或组合电路被输送到组件组装到电路板的摄取位置，以及位于吸收位置的吸收机构 检测电路板位置以准备装配过程的位置。 对准装置将电路板接收器定位在摄取位置处的预定方向位置。

    Roll for use in calendars or the like
    3.
    发明授权
    Roll for use in calendars or the like 失效
    卷用于日历等

    公开(公告)号：US4514887A

    公开(公告)日：1985-05-07

    申请号：US450110

    申请日：1982-12-15

    申请人： Richard Rauf ,  Josef Pav ,  Klaus Scholl

    发明人： Richard Rauf ,  Josef Pav ,  Klaus Scholl

    IPC分类号： D21F3/08 ,  B21B27/05 ,  B21B29/00 ,  B21B37/36 ,  D21F1/00 ,  D21G1/00 ,  D21G1/02 ,  F16C13/00 ,  B21B13/02

    CPC分类号： F16C13/028 ,  B21B37/36 ,  D21G1/022

    摘要： A calender roll wherein a hollow rotary cylindrical shell surrounds a stationary carrier and the latter supports a set of hydraulic cylinder and piston units serving to urge the external surface of a bearing element toward the internal surface of the shell. The external surface of the bearing element is formed with liquid-filled pockets each of which communicates with the cylinder chamber of a pressure generating unit. The cylinder chambers receive pressurized liquid from a pump via first conduits whose resistance to the flow of liquid is more pronounced than that of second conduits which directly connect the cylinder chambers with one or more hydropneumatic accumulators.

    摘要翻译： 一种压延辊，其中中空的旋转圆柱形壳体围绕静止载体，并且后者支撑一组液压缸和活塞单元，用于将轴承元件的外表面推向壳体的内表面。 轴承元件的外表面形成有液体填充的凹穴，每个凹槽与压力产生单元的气缸室连通。 气缸室通过第一导管接收来自泵的加压液体，第一导管对液体流的阻力比直接连接气缸室与一个或多个液压气动蓄能器的第二导管的阻力更显着。

    Method for assembling electronic circuits
    4.
    发明授权
    Method for assembling electronic circuits 失效
    电子电路组装方法

    公开(公告)号：US07552529B2

    公开(公告)日：2009-06-30

    申请号：US11543170

    申请日：2006-10-04

    申请人： Willibald Konrath ,  Helmut Greiner ,  Klaus Scholl ,  Werner Horzer

    发明人： Willibald Konrath ,  Helmut Greiner ,  Klaus Scholl ,  Werner Horzer

    IPC分类号： H05K3/30

    CPC分类号： H05K13/0465 ,  H05K13/0061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/5196 ,  Y10T29/53052 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/532

    摘要： A device for assembling electronic circuits comprises a placing station (7) for placing circuit components on a circuit carrier (1) held at a placing location (17), a fixing station (19) for fixing the circuit components to the circuit carrier (1) under the effect of heat, and a belt conveyor means (9) for conveying a circuit carrier from the placing location (17) to a take-over location (29) of the fixing station (19). The fixing station (19) comprises a heatable zone (22) and a manipulator (21) for raising the circuit carrier (1) from the take-over location (29) and placing it in the heatable zone (22). A continuous belt conveyor (9) of the belt conveyor means extends from the placing location (17) up to the take-over location (29).

    摘要翻译： 一种用于组装电子电路的装置包括放置台（7），用于将电路部件放置在保持在放置位置（17）的电路载体（1）上，固定站（19）用于将电路部件固定到电路载体 ）和用于将电路载体从放置位置（17）传送到定影站（19）的接收位置（29）的带式输送机装置（9）。 定影站（19）包括用于从接收位置（29）升高电路载体（1）并将其放置在可加热区域（22）中的可加热区域（22）和操纵器（21）。 带式输送装置的连续带式输送机（9）从放置位置（17）延伸到收纳位置（29）。

    Method for Gluing a Circuit Component to a Circuit Board
    5.
    发明申请
    Method for Gluing a Circuit Component to a Circuit Board 审中-公开
    将电路部件胶合到电路板的方法

    公开(公告)号：US20090014120A1

    公开(公告)日：2009-01-15

    申请号：US10597232

    申请日：2005-01-10

    申请人： Willibald Konrath ,  Klaus Scholl ,  Haiko Schmelcher ,  Ulf Muller

    发明人： Willibald Konrath ,  Klaus Scholl ,  Haiko Schmelcher ,  Ulf Muller

    IPC分类号： B32B7/14

    CPC分类号： H05K3/321 ,  H05K13/0469 ,  H05K2203/0126 ,  H05K2203/0522

    摘要： For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.

    摘要翻译： 为了将电路部件（17）胶合到电路板（1）上，首先将至少一个前进粘合剂点（14）放置在电路部件（17）和电路板（17）之间的接触区域（2）内 1），然后将粘合剂点（4）以规则图案放置，最后通过将电路部件（17）和电路板（1）彼此挤压而使粘合剂点（4）合并。

    Gluing method and device
    6.
    发明申请
    Gluing method and device 审中-公开
    胶合方法和装置

    公开(公告)号：US20070023138A1

    公开(公告)日：2007-02-01

    申请号：US10555250

    申请日：2004-04-30

    申请人： Willibald Konrath ,  Klaus Scholl ,  Haiko Schmelcher ,  Ralf Gortzen ,  Martin Nahring ,  Ulf Muller

    发明人： Willibald Konrath ,  Klaus Scholl ,  Haiko Schmelcher ,  Ralf Gortzen ,  Martin Nahring ,  Ulf Muller

    IPC分类号： B32B37/00

    CPC分类号： H05K13/0469 ,  H05K3/305 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T156/1089

    摘要： A method of gluing a circuit component onto a circuit board. The circuit component has a bottom area with at least one edge for bringing into contact with the circuit board. The distance between the edge and a first line parallel to the edge and an amount of adhesive to be applied per length unit along the line are determined such that, when placing the circuit component on the circuit board,the adhesive advances to the edge but not to a second circuit component adjacent to the edge. The adhesive is applied in the selected quantity along the first line and along further lines which are parallel to the first line and further away from the edge. Then, the circuit component is placed on the circuit board.

    摘要翻译： 将电路部件粘贴到电路板上的方法。 电路部件具有至少一个边缘的底部区域，用于与电路板接触。 确定边缘与平行于边缘的第一线之间的距离以及沿着线每长度单元施加的粘合剂的量，使得当将电路部件放置在电路板上时，粘合剂前进到边缘但不 到与边缘相邻的第二电路部件。 粘合剂沿着第一线以沿着与第一线平行并且远离边缘的另外的线施加在所选择的量中。 然后，将电路部件放置在电路板上。

    Automated circuit board assembly positioning system
    7.
    发明申请
    Automated circuit board assembly positioning system 有权
    自动化电路板组装定位系统

    公开(公告)号：US20050117311A1

    公开(公告)日：2005-06-02

    申请号：US10502703

    申请日：2003-01-28

    申请人： Ulf Miller ,  Willibald Konrath ,  Klaus Scholl ,  Dieter Kienzle ,  Lothar Ubele

    发明人： Ulf Miller ,  Willibald Konrath ,  Klaus Scholl ,  Dieter Kienzle ,  Lothar Ubele

    IPC分类号： H05K13/00 ,  H05K7/00

    CPC分类号： H05K13/0061

    摘要： An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.

    摘要翻译： 自动化电路板组装系统包括至少一个可移动电路板接收器，该可移动电路板接收器装备有空电路板或混合电路，该电路板或组合电路被输送到组件组装到电路板的摄取位置，以及位于吸收位置的吸收机构 检测电路板位置以准备装配过程的位置。 对准装置将电路板接收器定位在摄影位置处的预定方向位置。