Invention Application
- Patent Title: MULTILAYER PRINTED CIRCUIT BOARD
- Patent Title (中): 多层印刷电路板
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Application No.: US11733361Application Date: 2007-04-10
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Publication No.: US20090016671A1Publication Date: 2009-01-15
- Inventor: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD
- Current Assignee: IBIDEN CO., LTD
- Current Assignee Address: JP Ogaki-shi
- Priority: JP2004-308781 20041022
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H05K1/00 ; H01R12/04
Abstract:
The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers.
Public/Granted literature
- US3160891A Medical examination gown Public/Granted day:1964-12-15
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