发明申请
- 专利标题: Prepreg and laminate
- 专利标题(中): 预浸料和层压板
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申请号: US12216818申请日: 2008-07-11
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公开(公告)号: US20090017316A1公开(公告)日: 2009-01-15
- 发明人: Yoshihiro Kato , Takeshi Nobukuni , Masayoshi Ueno
- 申请人: Yoshihiro Kato , Takeshi Nobukuni , Masayoshi Ueno
- 专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 优先权: JP183125/2007 20070712
- 主分类号: B32B9/04
- IPC分类号: B32B9/04
摘要:
A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.
公开/授权文献
- US08815401B2 Prepreg and laminate 公开/授权日:2014-08-26