发明申请
US20090022949A1 Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing
审中-公开
功能元件安装模块，其制造方法，其中使用的树脂密封板和用于树脂密封的基板结构
- 专利标题： Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing
- 专利标题（中）： 功能元件安装模块，其制造方法，其中使用的树脂密封板和用于树脂密封的基板结构
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申请号： US12086152申请日： 2006-11-28
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公开(公告)号： US20090022949A1公开(公告)日： 2009-01-22
- 发明人: Yoshihito Horita , Shiyuki Kanisawa , Takahiro Asada , Yoshihiro Yoneda
- 申请人： Yoshihito Horita , Shiyuki Kanisawa , Takahiro Asada , Yoshihiro Yoneda
- 申请人地址： JP Tokyo
- 专利权人： SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人： SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-057876 20060303
- 国际申请： PCT/JP2006/323658 WO 20061128
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; B05D5/06 ; C08F2/48 ; B31B1/60
摘要：
Opposed to a substrate (2) having a functional element (1) with a functional portion (1a) mounted thereon, there is disposed a resin sealing plate (3) provided with an opening (3a) corresponding to the functional portion (1a) of the functional element (1) with a given spacing therebetween. Impregnation and filling of a sealing resin (5) in the spacing between the substrate (2) and the resin sealing plate (3) are carried out by the use of the capillary phenomenon. Thus, resin sealing of the functional element (1) can be realized without damaging to the function of the functional portion (1a).
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