发明申请
- 专利标题： Semiconductor Device and Method of Making Same
- 专利标题（中）： 半导体器件及其制作方法
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申请号： US12204502申请日： 2008-09-04
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公开(公告)号： US20090023253A1公开(公告)日： 2009-01-22
- 发明人: Masaya Tajima , Katsuya Kogiso , Mitsuo Watanabe , Toshiki Matsubara , Kenji Sato
- 申请人： Masaya Tajima , Katsuya Kogiso , Mitsuo Watanabe , Toshiki Matsubara , Kenji Sato
- 优先权： JP2001-287076 20010920
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The surface of the package is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the package and housing in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the device is easily produced by insert molding and has excellent moisture resistance.
公开/授权文献
- US07588962B2 Method of making semiconductor device 公开/授权日：2009-09-15
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