发明申请
- 专利标题: STRUCTURES OF POWERING ON INTEGRATED CIRCUIT
- 专利标题(中): 集成电路供电结构
-
申请号: US12163025申请日: 2008-06-27
-
公开(公告)号: US20090024972A1公开(公告)日: 2009-01-22
- 发明人: Igor Arsovski , Anthony R. Bonaccio , Serafino Bueti , Hayden C. Cranford, Jr. , Joseph A. Iadanza , Todd E. Leonard , Hemen R. Shah , Pradeep Thiagarajan , Sebastian T. Ventrone
- 申请人: Igor Arsovski , Anthony R. Bonaccio , Serafino Bueti , Hayden C. Cranford, Jr. , Joseph A. Iadanza , Todd E. Leonard , Hemen R. Shah , Pradeep Thiagarajan , Sebastian T. Ventrone
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.
公开/授权文献
- US07716007B2 Design structures of powering on integrated circuit 公开/授权日:2010-05-11
信息查询