发明申请
- 专利标题： Solder Mounting Structure, Manufacturing Method and Apparatus of the Solder Mounting Structure, Electronic Apparatus, and Wiring Board
- 专利标题（中）： 焊接安装结构，焊接安装结构的制造方法和装置，电子设备和接线板
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申请号： US12087083申请日： 2006-11-20
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公开(公告)号： US20090025972A1公开(公告)日： 2009-01-29
- 发明人: Katsuitsu Nishida , Kazuo Kinoshita
- 申请人： Katsuitsu Nishida , Kazuo Kinoshita
- 申请人地址： JP Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 优先权： JP2005-376473 20051227
- 国际申请： PCT/JP2006/323093 WO 20061120
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; G03B17/00 ; B23K31/02
摘要：
A camera module structure (100) of the present invention is arranged such that a heat-sensitive camera module (2) is joined to a printed wiring board (1) through solder joint sections (3). The printed wiring board (1) has through holes (11) formed therein and terminals (12) formed thereon so as to close front surface apertures which are formed by the through holes (11) in the mounting surface of the printed wiring board (1). The solder joint sections (3) are provided on the terminals (12), respectively. The solder joint sections (3) are formed by heating by light (heat rays) applied to the rear side of the printed wiring board (1) by way of the terminals (12) on the printed wiring board (1), so that heat is not transmitted to the camera module (2). Accordingly, the camera module structure (100) mounted on the printed wiring board (1) is realized without heat damage to the heat-sensitive camera module (2).
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