发明申请
- 专利标题: Semiconductor plastic package and fabricating method thereof
- 专利标题(中): 半导体塑料封装及其制造方法
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申请号: US12216375申请日: 2008-07-02
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公开(公告)号: US20090026604A1公开(公告)日: 2009-01-29
- 发明人: Joon-Sik Shin , Nobuyuki Ikeguchi , Keungjin Sohn , Joung-Gul Ryu , Sang-Youp Lee , Jung-Hwan Park , Ho-Sik Park
- 申请人: Joon-Sik Shin , Nobuyuki Ikeguchi , Keungjin Sohn , Joung-Gul Ryu , Sang-Youp Lee , Jung-Hwan Park , Ho-Sik Park
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0074210 20070724; KR10-2008-0042895 20080508
- 主分类号: H01L21/58
- IPC分类号: H01L21/58 ; H01L23/14
摘要:
A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.