发明申请
- 专利标题： Crosstalk-Free WLCSP Structure for High Frequency Application
- 专利标题（中）： 无串扰WLCSP结构，适用于高频应用
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申请号： US11782384申请日： 2007-07-24
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公开(公告)号： US20090026608A1公开(公告)日： 2009-01-29
- 发明人: Mon-Chin Tsai , Hsiu-Mei Yo , Chien-Min Lin , Chia-Jen Cheng , Li-Hsin Tseng
- 申请人： Mon-Chin Tsai , Hsiu-Mei Yo , Chien-Min Lin , Chia-Jen Cheng , Li-Hsin Tseng
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.
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