发明申请
- 专利标题： Test structure and test method
- 专利标题（中）： 测试结构和测试方法
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申请号： US11829104申请日： 2007-07-27
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公开(公告)号： US20090027074A1公开(公告)日： 2009-01-29
- 发明人: Wen-Hsiung Ko , Wen-Chun Chang , Kuan-Cheng Su
- 申请人： Wen-Hsiung Ko , Wen-Chun Chang , Kuan-Cheng Su
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; H01L21/66 ; H01L23/58
摘要：
The present invention discloses a wafer level test structure and a test method; in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.
公开/授权文献
- US07759957B2 Method for fabricating a test structure 公开/授权日：2010-07-20
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