To provide an energy ray-curable resin composition which exhibits equally high adhesive strength to various objects to be bonded, such as glasses, metals and plastics and which has good heat resistance and moisture resistance and is excellent also in rigidity, particularly an energy ray-curable resin composition having a low cure shrinkage and little adhesion strain.An energy ray-curable resin composition comprising (A) a (meth)acrylate having a molecular weight of from 500 to 5,000, of which the main chain backbone is at least one member selected from the group consisting of a polybutadiene, a polyisoprene and hydrogenated products thereof and which has at least one (meth)acryloyl group at an end of the main chain backbone or in a side chain, (B) a monofunctional (meth)acrylate having a C2-8 unsaturated hydrocarbon group via an ester bond, (C) a hydroxyl group-containing (meth)acrylate, (D) a polyfunctional (meth)acrylate, (E) a photopolymerization initiator, and (F) an antioxidant.