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发明申请
US20090032287A1 RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD USING THEM, AND MANUFACTURING METHOD THEREOF 有权
树脂涂层金属箔，金属层压板，印刷线路板及其制造方法

  • 专利标题： RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD USING THEM, AND MANUFACTURING METHOD THEREOF
  • 专利标题（中）： 树脂涂层金属箔，金属层压板，印刷线路板及其制造方法
  • 申请号： US12173885
    申请日： 2008-07-16
  • 公开(公告)号： US20090032287A1
    公开(公告)日： 2009-02-05
  • 发明人: Kenji Takai , Takayuki Sueyoshi
  • 申请人： Kenji Takai , Takayuki Sueyoshi
  • 优先权： JP2002-058162 20020305; JP2002-091885 20020328; JP2002-136052 20020510
  • 主分类号： B32B15/08
  • IPC分类号： B32B15/08 ;  C25D5/02 ;  H05K1/00
RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD USING THEM, AND MANUFACTURING METHOD THEREOF
摘要：
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
摘要（中）：

本发明提供一种金属包覆层压体或具有金属箔的树脂涂覆金属箔，其两面均不进行粗糙化处理，绝缘树脂组合物层使用通常使用的绝缘树脂，印刷电路板及其制造方法， 其中使用金属覆层压板或树脂涂覆的金属箔，其可靠性和电路成形性高，并且导体损耗极低。

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