Invention Application
US20090034147A1 Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
有权
用于提供具有降低的等离子体穿透和电弧放电的静电卡盘的方法和装置
- Patent Title: Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
- Patent Title (中): 用于提供具有降低的等离子体穿透和电弧放电的静电卡盘的方法和装置
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Application No.: US11888311Application Date: 2007-07-31
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Publication No.: US20090034147A1Publication Date: 2009-02-05
- Inventor: Kadthala Ramaya Narendrnath , Xinglong Chen , Sudhir Gondhalekar , Dmitry Lubomirsky , Muhammad Rasheed , Tony Kaushal
- Applicant: Kadthala Ramaya Narendrnath , Xinglong Chen , Sudhir Gondhalekar , Dmitry Lubomirsky , Muhammad Rasheed , Tony Kaushal
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
A method and apparatus for providing a fluid distribution element for an electrostatic chuck that reduces plasma formation and arcing within heat transfer fluid passages. One embodiment comprises a plate and a dielectric component, where the dielectric component is inserted into the plate. The plate is adapted to be positioned within a channel to define a plenum, wherein the dielectric component provides at least a portion of a fluid passage coupled to the plenum. A porous dielectric layer, formed upon the dielectric component, provides at least another portion of a fluid passage coupled to the plenum. In other embodiments, the fluid distribution element comprises various arrangements of components to define a fluid passage that does not provide a line-of-sight path from the support surface for a substrate to a plenum.
Public/Granted literature
- US07848076B2 Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing Public/Granted day:2010-12-07
Information query
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