发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- 专利标题(中): 半导体器件及其制造方法
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申请号: US12162769申请日: 2006-02-09
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公开(公告)号: US20090039335A1公开(公告)日: 2009-02-12
- 发明人: Motoyasu Terao , Kenzo Kurotsuchi , Riichiro Takemura , Norikatsu Takaura , Satoru Hanzawa
- 申请人: Motoyasu Terao , Kenzo Kurotsuchi , Riichiro Takemura , Norikatsu Takaura , Satoru Hanzawa
- 国际申请: PCT/JP2006/302240 WO 20060209
- 主分类号: H01L45/00
- IPC分类号: H01L45/00
摘要:
On an insulating film (31) in which a plug (35) is embedded, a second component releasing region (45) made of a first component and a second component, a solid electrolyte region (46) made of chalcogenide and an upper electrode region (47) are sequentially formed. The second component releasing region (45) made of a first component and a second component is composed of dome-shaped electrode portions (43) and an insulating film (44) burying the peripheries of the electrode portions (43), and at least one electrode portion (43) exists on the plug (34). The electrode portion (43) is composed of a first portion made of the first component such as tantalum oxide that is stable even when electric field is applied thereto and a second portion made of the second component such as copper or silver that is easily diffused in the solid electrolyte region (42) and moves therein by the application of an electric field. The second component supplied from the electrode portion (43) moves in the solid electrolyte region (46), thereby storing the information.
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