A probe card 6 is produced by forming probe pins 2, each having a thin film portion 21, three-dimensionally on a substrate 1 having a concave portion 11 formed thereon, forming bumps 3 at base end portions of the probe pins 2, moving the substrate 1 to the probe card substrate 4 side while supporting the same by a flip-chip bonder, bonding the probe pins 2 to pads 42 on said probe card substrate 4 via the bumps 3, then, moving the substrate 1 to the side separating from the probe card substrate 4 by the flip-chip bonder and rupturing the probe pins 2 at adjacent portions of the thin film portions 21 to mechanically remove the substrate 1 from the probe pins 2.