发明申请
US20090041568A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PLACING TABLE USED FOR SAME, AND MEMBER EXPOSED TO PLASMA
审中-公开
基板加工装置,用于其的基板放置台和暴露于等离子体的构件
- 专利标题: SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PLACING TABLE USED FOR SAME, AND MEMBER EXPOSED TO PLASMA
- 专利标题(中): 基板加工装置,用于其的基板放置台和暴露于等离子体的构件
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申请号: US12162900申请日: 2007-01-31
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公开(公告)号: US20090041568A1公开(公告)日: 2009-02-12
- 发明人: Sunao Muraoka , Jun Yamashita , Atsushi Ueda
- 申请人: Sunao Muraoka , Jun Yamashita , Atsushi Ueda
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-023281 20060131; JP2006-067734 20060313
- 国际申请: PCT/JP2007/051608 WO 20070131
- 主分类号: B65G47/22
- IPC分类号: B65G47/22 ; A47B37/00
摘要:
A substrate table includes a substrate table main body provided with a heater embedded therein and having an upper surface serving as a heating face for heating a target substrate, and lifter pins inserted in the substrate table main body and configured to be moved up and down. Recessed portions are formed in the heating face of the substrate table main body at positions corresponding to the lifter pins and have a bottom lower than the heating face. Each of the lifter pins includes a lifter pin main body and a head portion formed at a distal end of the lifter pin main body and having a diameter larger than the lifter pin main body, the head portion being formed to correspond to each recessed portion and to be partly accommodated in the recessed portion. The head portion has a head portion upper end for supporting the target substrate and a head portion lower surface opposite to the head portion upper end. The lifter pins are movable between a first state where the head portion lower surface engages with the bottom of the recessed portion, and a second state where the head portion lower surface separates upward from the bottom of the recessed portion.
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