发明申请
- 专利标题： Wired circuit board and connection structure between wired circuit boards
- 专利标题（中）： 有线电路板和有线电路板之间的连接结构
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申请号： US12219343申请日： 2008-07-21
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公开(公告)号： US20090044969A1公开(公告)日： 2009-02-19
- 发明人: Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
- 申请人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2007-189942 20070720
- 主分类号： H05K1/14
- IPC分类号： H05K1/14
摘要：
A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.
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