发明申请
US20090045510A1 SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP
有权
用于安装半导体芯片的半导体器件和方法
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP
- 专利标题（中）： 用于安装半导体芯片的半导体器件和方法
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申请号： US12187878申请日： 2008-08-07
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公开(公告)号： US20090045510A1公开(公告)日： 2009-02-19
- 发明人: Akihiko NAYA
- 申请人： Akihiko NAYA
- 优先权： JP2007-211327 20070814
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L21/58
摘要：
A semiconductor device includes a rigid substrate, a flexible solid-state image sensor and bumps. The bumps are aligned along a pair of opposing edges of the rigid substrate, and the diameter of the bumps gradually increases from the center to the ends of the edges. Owing to the difference in diameter of the bumps, the solid-state image sensor is curved convexly to the rigid substrate.
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