发明申请
US20090046757A1 Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
审中-公开
激光照射装置,激光照射方法以及半导体装置的制造方法
- 专利标题: Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
- 专利标题(中): 激光照射装置,激光照射方法以及半导体装置的制造方法
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申请号: US12222258申请日: 2008-08-06
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公开(公告)号: US20090046757A1公开(公告)日: 2009-02-19
- 发明人: Hidekazu Miyairi , Junpei Momo , Fumito Isaka
- 申请人: Hidekazu Miyairi , Junpei Momo , Fumito Isaka
- 申请人地址: JP Atsugi-shi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2007-212046 20070816
- 主分类号: H01S3/108
- IPC分类号: H01S3/108 ; G21G5/00
摘要:
An object is to provide a laser irradiation apparatus and a laser irradiation method with which positions of crystal grain boundaries generated at the time of laser crystallization can be controlled. Laser light emitted from a laser 101 is modulated into laser light having intensity distribution along a long-axis direction through a phase shift mask 103 and is transferred to an amorphous semiconductor film provided over an insulating substrate by a cylindrical lens 104 and a lens 105. The amorphous semiconductor film is crystallized by being scanned with the laser light.
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