A process for forming a releasable metal film includes depositing a metal onto a polymeric sheet such that the metal layer provides a low adhesive interface and exhibits relatively low stress. A barrier layer is then deposited onto the surface of the low adhesion interface. A thin film of a stress relief layer of silicon dioxide, aluminum oxide, copper or aluminum is then deposited followed by addition of a second barrier layer onto the stress relief layer. The stress relief layer provides compressive relief to balance the tensile stress of the so-stacked metal films. An additional solderable layer maybe added for soldering applications. To fabricate the working device with sputtering tools, an extremely high gas pressure is used to achieve low adhesion force between the wettable metallic layer and the polymeric carrier film.