公开(公告)号：US09057741B2

公开(公告)日：2015-06-16

申请号：US13554382

申请日：2012-07-20

Applicant: David M. Audette ,  Kevin Bocash ,  S. Jay Chey ,  Steven A. Cordes ,  Dustin M. Fregeau

Inventor： David M. Audette ,  Kevin Bocash ,  S. Jay Chey ,  Steven A. Cordes ,  Dustin M. Fregeau

IPC: G01R3/00 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06744 ,  G01R1/07314 ,  G01R3/00

Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

Abstract translation: 探针直接在测试基板上图案化，从而不需要插入器。 探针接触结构形成为具有较低水平部分的较大横向尺寸的上部水平部分的两级结构。 在施加到测试基板的掩模层中形成第一空腔，用导电材料填充空腔，并且平坦化导电材料部分的顶表面以形成较低的水平部分。 另一掩蔽层被施加在较低层部分上并被图案化以限定具有较小横向尺寸的第二空腔，下部水平部分。 第二腔被至少一个导电材料填充以形成探针接触结构的上部分。 可以使用每个探针接触结构的上部部分来穿透焊球的表面氧化物。

公开(公告)号：US08723534B2

公开(公告)日：2014-05-13

申请号：US12987353

申请日：2011-01-10

Applicant: S. Jay Chey ,  Hendrik F. Hamann ,  Levente I. Klein ,  Michael A. Schappert ,  Prabjit Singh

Inventor： S. Jay Chey ,  Hendrik F. Hamann ,  Levente I. Klein ,  Michael A. Schappert ,  Prabjit Singh

IPC: H01L21/00 ,  G01N27/403 ,  G01N17/04 ,  G01N17/00

CPC classification number: G01N33/0027 ,  G01N17/00 ,  G01N17/046 ,  G01N27/04 ,  H05K2201/09736 ,  Y10T29/49124

Abstract: A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.

Abstract translation: 腐蚀传感器包括具有不同厚度的多个金属条。 首先使用具有最小厚度的第一金属条来提供敏感的腐蚀检测。 在消耗第一金属带的暴露部分之后，可以使用具有第二最小厚度的第二金属带，以使用第二金属带的剩余未腐蚀部分提供连续敏感的腐蚀检测。 可以顺序地使用多个金属条，因为较薄金属条的暴露部分通过完全腐蚀变得不可用，而较厚金属条的未腐蚀暴露部分变得足够薄以提供敏感的腐蚀检测。

公开(公告)号：US20120234902A1

公开(公告)日：2012-09-20

申请号：US13487378

申请日：2012-06-04

Applicant: S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

Inventor： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

IPC: B23K31/02 ,  B23K3/06

CPC classification number: B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

Abstract: A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

Abstract translation: 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

公开(公告)号：US07987591B2

公开(公告)日：2011-08-02

申请号：US12540487

申请日：2009-08-13

Applicant: S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

Inventor： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

IPC: H01K3/10

CPC classification number: G01R3/00 ,  G01R1/07378

Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

Abstract translation: 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US20110079632A1

公开(公告)日：2011-04-07

申请号：US12571965

申请日：2009-10-01

Applicant: S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

Inventor： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

IPC: B23K31/02 ,  B23K37/06

CPC classification number: B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

Abstract: A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

Abstract translation: 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

公开(公告)号：US07784669B2

公开(公告)日：2010-08-31

申请号：US12536122

申请日：2009-08-05

Applicant: Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

Inventor： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

IPC: B23K35/24

CPC classification number: B23K1/19 ,  B23K35/262 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.

Abstract translation: 简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。 该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。 将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。 因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。 这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。 此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。 此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。

公开(公告)号：US20090051026A1

公开(公告)日：2009-02-26

申请号：US11841120

申请日：2007-08-20

Applicant: S. Jay Chey ,  Yves C. Martin ,  Theodore G. van Kessel

Inventor： S. Jay Chey ,  Yves C. Martin ,  Theodore G. van Kessel

IPC: H01L21/50 ,  H01L23/34

CPC classification number: H01L23/3735 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/28 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

Abstract: A process for forming a releasable metal film includes depositing a metal onto a polymeric sheet such that the metal layer provides a low adhesive interface and exhibits relatively low stress. A barrier layer is then deposited onto the surface of the low adhesion interface. A thin film of a stress relief layer of silicon dioxide, aluminum oxide, copper or aluminum is then deposited followed by addition of a second barrier layer onto the stress relief layer. The stress relief layer provides compressive relief to balance the tensile stress of the so-stacked metal films. An additional solderable layer maybe added for soldering applications. To fabricate the working device with sputtering tools, an extremely high gas pressure is used to achieve low adhesion force between the wettable metallic layer and the polymeric carrier film.

Abstract translation: 用于形成可释放金属膜的方法包括将金属沉积到聚合物片材上，使得金属层提供低粘合剂界面并显示相对低的应力。 然后将阻挡层沉积在低粘合界面的表面上。 然后沉积二氧化硅，氧化铝，铜或铝的应力消除层的薄膜，然后在应力消除层上添加第二阻挡层。 应力消除层提供压缩释放以平衡如此堆叠的金属膜的拉伸应力。 可以添加额外的可焊接层用于焊接应用。 为了用溅射工具制造工作装置，使用非常高的气压来实现可湿性金属层和聚合物载体膜之间的低粘附力。

公开(公告)号：US07417315B2

公开(公告)日：2008-08-26

申请号：US10310532

申请日：2002-12-05

Applicant: Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

Inventor： Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

IPC: H01L21/302 ,  B32B5/22 ,  G02B26/00

CPC classification number: B81B3/0035 ,  H01L2924/0002 ,  Y10T428/249986 ,  H01L2924/00

Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed. These devices have the technologically useful property of volumetrically expanding upon lowering of the device temperature below the reference or processing temperature.

Abstract translation: 用于微电子封装中弹性体复合材料和导电弹性体互连的TCE补偿或CTE补偿的负热膨胀系统（NTE）装置。 本发明的一个方面提供了一种用于制造具有负热膨胀系数的微机械装置的方法，该热膨胀系数可以制成用于操纵材料的TCE的复合材料。 这些设备和这些设备制成的复合材料属于称为“智能材料”或“响应材料”的材料类别。 本发明的另一方面提供了由双重相对的双层材料构成的微器件，其中两个双层仅在外围边缘处彼此附接，并且其中双层本身处于由温度定义的参考温度下的最小应力条件 双层形成。 当器件温度降低到参考温度或加工温度以下时，这些器件具有技术上有用的特性。

公开(公告)号：US06979518B2

公开(公告)日：2005-12-27

申请号：US10727925

申请日：2003-12-04

Applicant: Marie Angelopoulos ,  Katherina Babich ,  S. Jay Chey ,  Michael Straight Hibbs ,  Robert N. Lang ,  Arpan Pravin Mahorowala ,  Kenneth Christopher Racette

Inventor： Marie Angelopoulos ,  Katherina Babich ,  S. Jay Chey ,  Michael Straight Hibbs ,  Robert N. Lang ,  Arpan Pravin Mahorowala ,  Kenneth Christopher Racette

IPC: G03F1/32 ,  C23C14/06 ,  C23C14/08 ,  H01L21/027 ,  G03F9/00

CPC classification number: G03F1/32 ,  C23C14/0676 ,  C23C14/08

Abstract: An attenuating embedded phase shift photomask blank that produces a phase shift of the transmitted light is formed with an optically translucent film made of metal, silicon, nitrogen and oxygen. An etch stop layer is added to improve the etch selectivity of the phase shifting layer. A wide range of optical transmission (0.001% up to 15% at 157 nm) is obtained by this process.

Abstract translation: 通过由金属，硅，氮和氧制成的光学半透明的膜形成产生透射光的相移的衰减的嵌入式相移光掩模坯料。 加入蚀刻停止层以改善相移层的蚀刻选择性。 通过该方法获得宽范围的光学透射（0.001nm至15％，157nm）。

公开(公告)号：US06730445B2

公开(公告)日：2004-05-04

申请号：US10303341

申请日：2002-11-22

Applicant: Marie Angelopoulos ,  Katherina Babich ,  S. Jay Chey ,  Michael Straight Hibbs ,  Robert N. Lang ,  Arpan Pravin Mahorowala ,  Kenneth Christopher Racette

Inventor： Marie Angelopoulos ,  Katherina Babich ,  S. Jay Chey ,  Michael Straight Hibbs ,  Robert N. Lang ,  Arpan Pravin Mahorowala ,  Kenneth Christopher Racette

IPC: G03F900

CPC classification number: G03F1/32 ,  C23C14/0676 ,  C23C14/08

Abstract: An attenuating embedded phase shift photomask blank that produces a phase shift of the transmitted light is formed with an optically translucent film made of metal, silicon, nitrogen and oxygen. An etch stop layer is added to improve the etch selectivity of the phase shifting layer. A wide range of optical transmission (0.001% up to 15% at 157 nm) is obtained by this process.