Provided is a silver conductive film, a thin film of silver comprising a sintered layer of silver particles having a mean particle size DTEM of at most 100 nm. Its specific resistance is at most 5 μΩ·cm, the ratio of the voids in the sintered layer is at most 3/μm2, and the film has a texture structure with a surface roughness Ra of from 10 to 100 nm. The silver conductive film having such a texture structure may be produced according to a production process comprising a step of applying a silver particle dispersion of silver particles having a mean particle size DTEM of at most 100 nm dispersed in a non-polar or poorly-polar liquid organic medium having a boiling point of from 60 to 300° C., onto a substrate to form a coating film thereon, and thereafter baking the coating film.