Invention Application
- Patent Title: Method of fabricating multilayer printed circuit board
- Patent Title (中): 制造多层印刷电路板的方法
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Application No.: US12005610Application Date: 2007-12-28
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Publication No.: US20090056119A1Publication Date: 2009-03-05
- Inventor: Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
- Applicant: Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0088346 20070831; KR10-2007-0088347 20070831
- Main IPC: H05K3/00
- IPC: H05K3/00
Abstract:
Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
Public/Granted literature
- US07707715B2 Method of fabricating multilayer printed circuit board Public/Granted day:2010-05-04
Information query
