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发明申请
US20090061199A1 Coating liquid for formation of protective film for semiconductor processing, method for preparation of the same, and protective film for semiconductor processing made from the coating liquid 有权
用于形成用于半导体加工的保护膜的涂布液，其制备方法和由涂布液制成的用于半导体加工的保护膜

  • 专利标题： Coating liquid for formation of protective film for semiconductor processing, method for preparation of the same, and protective film for semiconductor processing made from the coating liquid
  • 专利标题（中）： 用于形成用于半导体加工的保护膜的涂布液，其制备方法和由涂布液制成的用于半导体加工的保护膜
  • 申请号： US11665747
    申请日： 2005-10-11
  • 公开(公告)号： US20090061199A1
    公开(公告)日： 2009-03-05
  • 发明人: Miki Egami , Hiroki Arao , Akira Nakashima , Michio Komatsu
  • 申请人： Miki Egami , Hiroki Arao , Akira Nakashima , Michio Komatsu
  • 优先权： JP2004-305662 20041020
  • 国际申请： PCT/JP05/18668 WO 20051011
  • 主分类号： B32B3/26
  • IPC分类号： B32B3/26 ;  C09D7/12
Coating liquid for formation of protective film for semiconductor processing, method for preparation of the same, and protective film for semiconductor processing made from the coating liquid
摘要：
Disclosed is a coating liquid for forming a protective film having high film strength and a low specific dielectric constant for semiconductor processing, and a method for preparing the coating liquid. The coating liquid is a liquid composition comprising (a) silicon compound obtained by hydrolyzing tetraalkyl orthosilicate (TAOS) and alkoxysilane (AS) in the presence of tetraalkyl ammonium hydroxide (TAAOH) and water, or a silicon compound obtained by hydrolyzing or partially hydrolyzing tetraalkyl orthosilicate (TAOS) in the presence of tetraalkyl ammonium hydroxide (TAAOH) and water, mixing the hydrolyzed or partially hydrolyzed product with alkoxysilane (AS) or a hydrolyzed or partially hydrolyzed product thereof, and hydrolyzing all or a portion of the mixture, (b) an organic solvent, and (c) water. The coating liquid is characterized in that a quantity of water contained in the liquid composition is in the range from 35 to 65% by weight.
摘要（中）：

公开了一种用于形成用于半导体加工的具有高膜强度和低比介电常数的保护膜的涂布液，以及一种制备涂布液的方法。 涂布液是一种液体组合物，其包含（a）在四烷基氢氧化铵（TAAOH）和水的存在下水解四烷基原硅酸酯（TAOS）和烷氧基硅烷（AS）而获得的硅化合物，或通过水解或部分水解四烷基 在四烷基氢氧化铵（TAAOH）和水的存在下，将水解或部分水解的产物与烷氧基硅烷（AS）或其水解或部分水解产物混合，并水解所有或部分混合物，（b） ）有机溶剂，和（c）水。 涂布液的特征在于，液体组合物中含有的水的量在35至65重量％的范围内。

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