发明申请
- 专利标题: SOLID-STATE IMAGING DEVICE
- 专利标题(中): 固态成像装置
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申请号: US12268126申请日: 2008-11-10
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公开(公告)号: US20090065832A1公开(公告)日: 2009-03-12
- 发明人: Fujio MASUOKA , Hiroki Nakamura
- 申请人: Fujio MASUOKA , Hiroki Nakamura
- 申请人地址: JP Chuo-Ku
- 专利权人: Unisantis Electronics (Japan) Ltd.
- 当前专利权人: Unisantis Electronics (Japan) Ltd.
- 当前专利权人地址: JP Chuo-Ku
- 优先权: JPPCT/JP2007/067732 20070912
- 主分类号: H01L31/00
- IPC分类号: H01L31/00 ; H01L21/00
摘要:
It is an object of the present invention to provide an image sensor having a high ratio of a surface area of a light receiving element to a surface area of one pixel. The above-described object is achieved by an inventive solid-state imaging device unit comprising solid-state imaging devices arranged on a substrate according to the present invention. The solid-state imaging device comprises a signal line formed on the substrate, an island shaped semiconductor placed over the signal line, and a pixel selection line connected to an upper portion of the island shaped semiconductor. The island shaped semiconductor comprises a first semiconductor layer disposed in a lower portion of the island shaped semiconductor and connected to the signal line, a second semiconductor layer disposed adjacent to an upper side of the first semiconductor layer, a gate connected to the second semiconductor layer via an insulating film, an electric charge accumulator comprising a third semiconductor layer connected to the second semiconductor layer and carrying a quantity of electric charges which varies in response to a light reception, and a fourth semiconductor layer disposed adjacent to an upper side of the second semiconductor layer and the third semiconductor layer and connected to the pixel selection line. The solid-state imaging devices are arranged on the substrate in a honeycomb configuration.
公开/授权文献
- US07872287B2 Solid-state imaging device 公开/授权日:2011-01-18
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