发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
-
申请号: US12262481申请日: 2008-10-31
-
公开(公告)号: US20090065926A1公开(公告)日: 2009-03-12
- 发明人: Takeshi WAKABAYASHI , Ichiro Mihara
- 申请人: Takeshi WAKABAYASHI , Ichiro Mihara
- 申请人地址: JP Tokyo
- 专利权人: Casio Computer Co., Ltd.
- 当前专利权人: Casio Computer Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-361092 20041214; JP2004-362117 20041215
- 主分类号: H01L23/488
- IPC分类号: H01L23/488
摘要:
A semiconductor device includes a base plate made of a material including at least a thermosetting resin, and having an opening, a vertical conductor filled and provided in the opening of the base plate, at least one semiconductor construct having a semiconductor substrate and a plurality of external connection electrodes provided on one side of the semiconductor substrate, and an insulating layer secured to and provided on a periphery of the semiconductor construct. The insulating layer is secured to the base plate, and the external connection electrodes of the semiconductor construct are bonded to the vertical conductor.