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发明申请
US20090071697A1 Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof 有权
橡胶改性聚酰胺树脂，环氧树脂组合物及其固化产品

Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof
摘要：
The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2), —(CH2—CH═CH—CH2)X—  (B-1) —(CH2—CH═CH—CH2)Y—(CH2—CH(CN))Z—  (B-2) (wherein, each of x, y and z is an average value and 0.01≦z/(y+z)≦0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.
摘要（中）：

本发明涉及一种含酚羟基的橡胶改性聚酰胺树脂，其分子中含有具有由下式（A）表示的结构的含酚羟基的芳族聚酰胺链段（其中m和n分别为 平均值，Ar表示二价芳族基团）和选自下式（B-1）或（B-2）的丁二烯（共）聚合物链段，<？在线公式描述=“在线公式” 末端=“铅”→>（CH2-CH-CH-CH2）X-（B-1）<？在线公式描述=“在线公式”end =“tail”？> - （CH2-CH-CH-CH2）Y-（CH2-CH（CN））Z-（B-2）<？line line line line line line -formulae description =“In-line Formulas”end =“tail”？>（其中，x，y和z各自为平均值，0.01 <= z /（y + z）<= 0.13，x表示正数 数量为5〜200，y + z为10〜200的正数），以及含有所述树脂，特别是环氧树脂组合物的树脂组合物; 所述环氧树脂组合物的固化物的柔软性，耐热性和电特性优异，特别是在高温高湿下。

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