发明申请
US20090073713A1 LED Multidimensional Printed Wiring Board Using Standoff Boards
审中-公开
LED多维印刷线路板使用分离板
- 专利标题： LED Multidimensional Printed Wiring Board Using Standoff Boards
- 专利标题（中）： LED多维印刷线路板使用分离板
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申请号： US11851844申请日： 2007-09-07
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公开(公告)号： US20090073713A1公开(公告)日： 2009-03-19
- 发明人: Andrew Z. Glovatsky , Steven D. McCarthy , Richard T. McCarthy , Joseph Binetti , Donald Pope
- 申请人： Andrew Z. Glovatsky , Steven D. McCarthy , Richard T. McCarthy , Joseph Binetti , Donald Pope
- 主分类号： H01J61/94
- IPC分类号： H01J61/94 ; B60Q1/00 ; F21V5/00 ; F21V21/00
摘要：
A substrate assembly for use in a lamp has a main printed wiring board and a standoff board. The main printed wiring board has a main surface with one or more LED packages disposed on the main surface and electrically connected thereto. The standoff board is disposed on the main surface of the main printed wiring board. The standoff board has an LED package disposed thereon and conductors to provide an electrical connection between the LED package disposed on the standoff board and the main printed wiring board.
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