利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.028 秒)

    SIGNATURE LIGHTING SYSTEM FOR APPLIANCE
    2.
    发明申请
    SIGNATURE LIGHTING SYSTEM FOR APPLIANCE 审中-公开
    签字照明系统

    公开(公告)号：US20120127696A1

    公开(公告)日：2012-05-24

    申请号：US12951645

    申请日：2010-11-22

    申请人： Andrew Z. Glovatsky

    发明人： Andrew Z. Glovatsky

    IPC分类号： F25D27/00

    CPC分类号： F25D27/00 ,  D06F58/20 ,  D06F2058/2883 ,  F21S43/237 ,  F25D23/028 ,  F25D2327/001 ,  G02B6/001

    摘要： A signature lighting system for an appliance includes a carrier, a light guide disposed adjacent the carrier, a light source disposed adjacent the light guide and in electrical communication with a source of electrical energy to selectively energize the light source, wherein the light source emits light into the light guide, and a light housing received in the carrier and substantially enclosing the light source, wherein at least one of the light housing and the carrier militates against a relative motion between the light guide and the carrier.

    摘要翻译： 用于器具的签名照明系统包括载体，邻近载体设置的光导，邻近光导设置并与电能源电连通的光源，以选择性地激励光源，其中光源发光 以及容纳在所述载体中并且基本上包围所述光源的灯壳体，其中所述灯壳体和所述载体中的至少一个能够抵抗所述光导和所述载体之间的相对运动。

    LED interconnect spring clip assembly
    3.
    发明授权
    LED interconnect spring clip assembly 有权
    LED互连弹簧夹组件

    公开(公告)号：US07510400B2

    公开(公告)日：2009-03-31

    申请号：US11686101

    申请日：2007-03-14

    申请人： Andrew Z. Glovatsky ,  Jeff C. Lin

    发明人： Andrew Z. Glovatsky ,  Jeff C. Lin

    IPC分类号： H01R12/00

    CPC分类号： F21V19/004 ,  F21S41/141 ,  F21V19/0025 ,  H01L2224/48091 ,  H01R13/24 ,  Y10S362/80 ,  H01L2924/00014

    摘要： An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

    摘要翻译： LED互连弹簧夹组件包括具有中心腔和多个接触特征的壳体。 每个接触特征具有由壳体保持的部分和可操作以接触设置在壳体的中心空腔内的LED封装的端子的部分。 LED连接弹簧夹组件在安装到基板上时保持LED封装。

    Three-dimensional molded sockets for mechanical and electrical component attachment
    6.
    发明授权
    Three-dimensional molded sockets for mechanical and electrical component attachment 失效
    用于机械和电气部件连接的三维模制插座

    公开(公告)号：US5994648A

    公开(公告)日：1999-11-30

    申请号：US826461

    申请日：1997-03-27

    申请人： Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

    发明人： Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

    IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

    CPC分类号： H05K3/326 ,  H05K1/119 ,  H05K1/183 ,  H05K1/184 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K3/284 ,  Y02P70/611

    摘要： An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

    摘要翻译： 不需要焊接处理的电路组件，包括具有布置在其表面中的至少一个上的终端的电子部件，以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔，其中，空腔基本上符合电子形状 零件。 近似空腔是与电子部件的各个端子匹配的多个电触点，其中至少一个电触点连接到基板上的至少一个电路迹线。 空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合，使得当部件放置在其中时，部件保持在腔内。 组件设置在空腔中，使得其端子与其相应的电触点物理和电连接。

    Circuit-carrying automotive component and method of manufacturing the same
    7.
    发明授权
    Circuit-carrying automotive component and method of manufacturing the same 失效
    电路承载汽车部件及其制造方法

    公开(公告)号：US5754398A

    公开(公告)日：1998-05-19

    申请号：US654489

    申请日：1996-05-28

    申请人： Andrew Z. Glovatsky ,  Alice Zitzmann

    发明人： Andrew Z. Glovatsky ,  Alice Zitzmann

    IPC分类号： B29C45/14 ,  H05K1/02 ,  H05K3/00 ,  H05K7/20

    CPC分类号： B29C45/14344 ,  B29C45/14754 ,  H05K3/0058 ,  B29C45/14311 ,  H05K1/0271 ,  H05K2201/09036 ,  H05K2203/1327 ,  Y10T29/49172

    摘要： A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.

    摘要翻译： 提供一种承载电路的汽车部件及其制造方法。 在本发明的优选实施方案中，组分包括由在预定高温下熔融的聚合物制成的基材。 该部件还包括电路板，该电路板限定穿过其中的孔，其适于在升高的温度下接收熔融聚合物，以及由熔融聚合物通过该孔形成的紧固件。 紧固件与基板成一体，并将电路板机械地固定到基板上。 电路板由耐高温熔融聚合物熔化的材料制成。

    Circuit clip connector
    8.
    发明授权
    Circuit clip connector 失效
    电路夹连接器

    公开(公告)号：US5752851A

    公开(公告)日：1998-05-19

    申请号：US596841

    申请日：1996-02-05

    申请人： Victor V. Zaderej ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Peter J. Sinkunas

    发明人： Victor V. Zaderej ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Peter J. Sinkunas

    IPC分类号： H01R4/48 ,  H01R12/62 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/07

    CPC分类号： H01R12/62

    摘要： A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.

    摘要翻译： 夹子连接器包括细长主体，从主体延伸的附接臂和用于施加从主体延伸的压力的突起。 主体基本上是细长的，连接臂在每一端处一个。 中间连接臂是多个突起，用于产生在其间具有空间并且适于与电导体对准的压力点，使得能够对电导体施加压力并且可以进行电连接。

    Localized soldering station using state changing medium
    10.
    发明授权
    Localized soldering station using state changing medium 失效
    使用状态转换介质的本地焊台

    公开(公告)号：US5102028A

    公开(公告)日：1992-04-07

    申请号：US725415

    申请日：1991-07-01

    申请人： Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

    发明人： Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

    IPC分类号： B23K1/00 ,  B23K1/015 ,  B23K1/018 ,  H05K13/04

    CPC分类号： H05K13/0465 ,  B23K1/0016 ,  B23K1/015 ,  B23K1/018 ,  B23K2201/42

    摘要： A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.

    摘要翻译： 描述了使用气相回流原理的局部焊接站。 容器具有选择的介质，因为其变化到蒸气的温度。 一个加热的导管保持蒸汽状态，同时将蒸气输送到一个工作位置，在那里一个模块具有要被去除或通过焊接连接附着的部件。 透明的石英喷嘴将蒸气限制在零件上及其焊接连接处，并通过包括引导灯的单元精确定位。 蒸汽将在与零件及其焊料连接接触时失去其蒸发潜热，导致焊料回流并返回到液体中，液体被收集以供再利用。 当处于待机状态或就绪状态时，蒸汽通过冷却片向上通过截止阀向上传送，在此处，蒸汽变回液体并返回容器，避免损失。