发明申请
US20090075428A1 ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
失效
用于集成电路电路封装的电磁屏蔽形成
- 专利标题： ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- 专利标题（中）： 用于集成电路电路封装的电磁屏蔽形成
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申请号： US11961827申请日： 2007-12-20
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公开(公告)号： US20090075428A1公开(公告)日： 2009-03-19
- 发明人: Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- 申请人： Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.
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