Calibration standards and methods of their fabrication and use
    1.
    发明授权
    Calibration standards and methods of their fabrication and use 有权
    校准标准及其制作和使用方法

    公开(公告)号:US08290736B2

    公开(公告)日:2012-10-16

    申请号:US12710497

    申请日:2010-02-23

    申请人: Jinbang Tang

    发明人: Jinbang Tang

    IPC分类号: G01R31/02

    摘要: An embodiment of a calibration standard includes a substrate, a set of conductive structures fabricated on the substrate, and a conductive end structure fabricated on the substrate. The set of conductive structures include an inner conductive structure, a first outer conductive structure positioned to one side of the inner conductive structure, and a second outer conductive structure positioned to an opposite side of the inner conductive structure. The inner and outer conductive structures are aligned in parallel with each other along offset principal axes of the inner and outer conductive structures. The conductive end structure is electrically connected between an end of the first outer conductive structure and an end of the second outer conductive structure, and the conductive end structure is spatially separated from an end of the inner conductive structure at the surface of the substrate.

    摘要翻译: 校准标准的实施例包括衬底,在衬底上制造的一组导电结构以及在衬底上制造的导电端结构。 该组导电结构包括内导电结构,位于内导电结构一侧的第一外导电结构和位于内导电结构相对侧的第二外导电结构。 内部和外部导电结构沿着内部和外部导电结构的偏移主轴线彼此平行排列。 导电端部结构电连接在第一外部导电结构的端部和第二外部导电结构的端部之间,并且导电端部结构在衬底的表面处与内部导电结构的端部在空间上分离。

    Electronic device module with integrated antenna structure, and related manufacturing method
    6.
    发明授权
    Electronic device module with integrated antenna structure, and related manufacturing method 有权
    具有集成天线结构的电子设备模块及相关制造方法

    公开(公告)号:US09172143B2

    公开(公告)日:2015-10-27

    申请号:US13751318

    申请日:2013-01-28

    申请人: Jinbang Tang

    发明人: Jinbang Tang

    IPC分类号: H01L25/00 H01Q9/04 H01Q1/22

    摘要: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

    摘要翻译: 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 电子器件封装件与导电接地层一起固定在封装材料内。 接地层具有电子器件封装所在的器件开口,接地层还具有与器件开口间隔开的天线开口。 器件触点和接地层的一侧对应于第一表面,并且贴片天线元件覆盖在第一表面上。 天线元件耦合到电子设备封装,并且贴片天线元件在第一表面上的投影位于天线开口内。 还提供了用于制造这种电子设备模块的方法。

    ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD
    7.
    发明申请
    ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD 有权
    具有集成天线结构的电子装置模块及相关制造方法

    公开(公告)号:US20130135152A1

    公开(公告)日:2013-05-30

    申请号:US13751318

    申请日:2013-01-28

    申请人: Jinbang Tang

    发明人: Jinbang Tang

    IPC分类号: H01Q9/04

    摘要: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

    摘要翻译: 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 电子器件封装件与导电接地层一起固定在封装材料内。 接地层具有电子器件封装所在的器件开口,接地层还具有与器件开口间隔开的天线开口。 器件触点和接地层的一侧对应于第一表面,并且贴片天线元件覆盖在第一表面上。 天线元件耦合到电子设备封装,并且贴片天线元件在第一表面上的投影位于天线开口内。 还提供了用于制造这种电子设备模块的方法。

    Method of manufacting an electronic device module with integrated antenna structure
    8.
    发明授权
    Method of manufacting an electronic device module with integrated antenna structure 有权
    制造具有集成天线结构的电子设备模块的方法

    公开(公告)号:US08407890B2

    公开(公告)日:2013-04-02

    申请号:US12692996

    申请日:2010-01-25

    申请人: Jinbang Tang

    发明人: Jinbang Tang

    IPC分类号: H05K3/30

    摘要: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device module can be manufactured by providing an electrically conductive ground plane having a device opening for an electronic device package, and having an antenna ground section. The manufacturing method continues by embedding the ground plane and the electronic device package in encapsulating material such that device contacts of the electronic device package and a first side of the ground plane reside at a device mounting surface. Thereafter, an antenna circuit structure is formed overlying the device mounting surface. The antenna circuit structure includes an antenna signal element that cooperates with the antenna ground section to form an integrated antenna for the electronic device module.

    摘要翻译: 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 可以通过提供具有用于电子设备封装的器件开口并具有天线接地部分的导电接地平面来制造电子器件模块。 该制造方法通过将接地平面和电子器件封装嵌入到封装材料中而继续,使得电子器件封装的器件触点和接地平面的第一侧驻留在器件安装表面。 此后,在装置安装表面上形成天线电路结构。 天线电路结构包括与天线接地部分配合以形成用于电子设备模块的集成天线的天线信号元件。

    Shielding structures for signal paths in electronic devices
    9.
    发明授权
    Shielding structures for signal paths in electronic devices 有权
    电子设备信号路径屏蔽结构

    公开(公告)号:US08385084B2

    公开(公告)日:2013-02-26

    申请号:US12962893

    申请日:2010-12-08

    IPC分类号: H05K9/00

    摘要: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.

    摘要翻译: 提供屏蔽结构,用于屏蔽在电子器件中在第一方向和第二层之间延伸的信号路径,该过渡区域具有沿与第一方向正交的第一方向和第二方向延伸的过渡。 屏蔽结构包括屏蔽结构部分,其包括在过渡处的信号路径的第一区域附近的第一屏蔽通孔; 靠近信号路径的第二区域的第二屏蔽通道; 以及电耦合到第一屏蔽通孔的区域金属化。

    Microelectronic assembly with an embedded waveguide adapter and method for forming the same
    10.
    发明授权
    Microelectronic assembly with an embedded waveguide adapter and method for forming the same 有权
    具有嵌入式波导适配器的微电子组件及其形成方法

    公开(公告)号:US08283764B2

    公开(公告)日:2012-10-09

    申请号:US13436432

    申请日:2012-03-30

    申请人: Jinbang Tang

    发明人: Jinbang Tang

    IPC分类号: H01L23/06

    摘要: A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor.

    摘要翻译: 提供微电子组件和用于形成微电子组件的方法。 提供半导体衬底。 半导体衬底具有第一和第二相对侧面以及第一和第二部分。 调谐凹陷形成在半导体衬底的第二相对侧和第二部分上。 射频导体形成在第一半导体衬底的第一相对侧上。 射频导体具有在第一半导体衬底的第一部分上的第一端和第一半导体衬底的第二部分上的第二端。 其中形成有集成电路的微电子管芯被附接到半导体衬底的第一相对侧和第一部分,使得集成电路电连接到射频导体的第一端。