Invention Application
US20090079074A1 Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted
审中-公开
具有去耦电容器的半导体器件形成在其上安装有半导体芯片的衬底上
- Patent Title: Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted
- Patent Title (中): 具有去耦电容器的半导体器件形成在其上安装有半导体芯片的衬底上
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Application No.: US12232008Application Date: 2008-09-09
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Publication No.: US20090079074A1Publication Date: 2009-03-26
- Inventor: Kazuhiro Motonaga
- Applicant: Kazuhiro Motonaga
- Applicant Address: JP Kawasaki
- Assignee: NEC ELECTRONICS CORPORATION
- Current Assignee: NEC ELECTRONICS CORPORATION
- Current Assignee Address: JP Kawasaki
- Priority: JP2007-246640 20070925
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
A semiconductor device includes a substrate having a first surface and a second surface opposing to the first surface, a semiconductor chip mounted on the first surface of the substrate, a first pad formed on the first surface of the substrate to electrically connect to a first terminal of the semiconductor chip, a second pad formed on the second surface of the substrate to electrically connect to a second terminal of the semiconductor chip, and a decoupling capacitor formed on the first surface and including the first and second pads serving as electrodes of the decoupling capacitor.
Information query
IPC分类:
