公开(公告)号：US20060103004A1

公开(公告)日：2006-05-18

申请号：US11274182

申请日：2005-11-16

Applicant: Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

Inventor： Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

IPC: H01L23/12

CPC classification number: H05K1/0218 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/0715 ,  H01L2224/0401

Abstract: It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of mounting an LSI of an area-array structure. In a multilayer wiring board for a package, which comprises, on a wiring layer of an LSI chip mount surface, a ground pad, a power supply pad, and a signal pad for mounting LSI chip, and a ground plane that extends around a group of those pads, the ground pad disposed on the inner side, among the above-described pads, is connected to the ground plane that surrounds the pad group through a connecting wiring.

Abstract translation: 提供一种用于半导体集成电路封装的布线板，其具有优异的信号特性和用于降低安装区域阵列结构的LSI时的开关噪声的高效果。 在一种用于封装的多层布线板中，其包括在LSI芯片安装表面的布线层上的接地焊盘，电源焊盘和用于安装LSI芯片的信号焊盘以及围绕一组延伸的接地平面 在这些焊盘中，设置在上述焊盘中的内侧的接地焊盘通过连接布线连接到围绕焊盘组的接地平面。

公开(公告)号：US20090079074A1

公开(公告)日：2009-03-26

申请号：US12232008

申请日：2008-09-09

Applicant: Kazuhiro Motonaga

Inventor： Kazuhiro Motonaga

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/162 ,  H05K2201/09763 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate having a first surface and a second surface opposing to the first surface, a semiconductor chip mounted on the first surface of the substrate, a first pad formed on the first surface of the substrate to electrically connect to a first terminal of the semiconductor chip, a second pad formed on the second surface of the substrate to electrically connect to a second terminal of the semiconductor chip, and a decoupling capacitor formed on the first surface and including the first and second pads serving as electrodes of the decoupling capacitor.

Abstract translation: 一种半导体器件，包括具有第一表面和与第一表面相对的第二表面的衬底，安装在衬底的第一表面上的半导体芯片，形成在衬底的第一表面上的第一焊盘，以电连接到第一端子 所述第二焊盘形成在所述衬底的所述第二表面上以电连接到所述半导体芯片的第二端子，以及形成在所述第一表面上并且包括用作所述解耦的电极的所述第一和第二焊盘的去耦电容器 电容器。

公开(公告)号：US07321166B2

公开(公告)日：2008-01-22

申请号：US11274182

申请日：2005-11-16

Applicant: Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

Inventor： Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

IPC: H01L23/12

CPC classification number: H05K1/0218 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/0715 ,  H01L2224/0401

Abstract: It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of mounting an LSI of an area-array structure. In a multilayer wiring board for a package, which comprises, on a wiring layer of an LSI chip mount surface, a ground pad, a power supply pad, and a signal pad for mounting LSI chip, and a ground plane that extends around a group of those pads, the ground pad disposed on the inner side, among the above-described pads, is connected to the ground plane that surrounds the pad group through a connecting wiring.

Abstract translation: 提供一种用于半导体集成电路封装的布线板，其具有优异的信号特性和用于降低安装区域阵列结构的LSI时的开关噪声的高效果。 在一种用于封装的多层布线板中，其包括在LSI芯片安装表面的布线层上的接地焊盘，电源焊盘和用于安装LSI芯片的信号焊盘以及围绕一组延伸的接地平面 在这些焊盘中，设置在上述焊盘中的内侧的接地焊盘通过连接布线连接到围绕焊盘组的接地平面。