发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS
- 专利标题（中）： 具有多个器件单元的集成电路封装系统
-
申请号： US11858588申请日： 2007-09-20
-
公开(公告)号： US20090079096A1公开(公告)日： 2009-03-26
- 发明人: Lionel Chien Tay , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Arnel Trasporto
- 申请人： Lionel Chien Tay , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Arnel Trasporto
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed.
公开/授权文献
信息查询
IPC分类:
