发明申请
- 专利标题： HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE
- 专利标题（中）： 控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法
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申请号： US12282984申请日： 2007-03-09
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公开(公告)号： US20090081852A1公开(公告)日： 2009-03-26
- 发明人: Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
- 申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
- 申请人地址： JP Chuo-ku JP Itabashi-ku
- 专利权人： SHIN-ETSU POLYMER CO., LTD.,LINTEC CORPORATION
- 当前专利权人： SHIN-ETSU POLYMER CO., LTD.,LINTEC CORPORATION
- 当前专利权人地址： JP Chuo-ku JP Itabashi-ku
- 优先权： JP2006-070816 20060315; JP2006-071488 20060315; JP2006-071489 20060315
- 国际申请： PCT/JP2007/054628 WO 20070309
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B41/06
摘要：
A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.