发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE
- 专利标题（中）： 具有多个DIE的集成电路封装系统
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申请号： US11863700申请日： 2007-09-28
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公开(公告)号： US20090085181A1公开(公告)日： 2009-04-02
- 发明人: Abelardo Hadap Advincula, JR. , Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
- 申请人： Abelardo Hadap Advincula, JR. , Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/58
摘要：
An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.
公开/授权文献
- US08067825B2 Integrated circuit package system with multiple die 公开/授权日：2011-11-29