A stack-type semiconductor package, a method of forming the same, and an electronic system including the same are provided. The stack-type semiconductor package includes: a lower printed circuit board having a plurality of connection bumps disposed on an upper surface of the lower printed circuit board and a plurality of lower interconnections; at least one first lower chip sequentially stacked on the lower printed circuit board and electrically connected to the plurality of lower interconnections; a lower molding resin compound disposed on the lower printed circuit board and covering the first lower chips; a double-sided wiring board bonded to the lower molding resin compound and electrically connected to the connection bumps; and an upper chip package bonded to the double-sided wiring board and having upper bumps electrically connected to an interconnection pattern of the double-sided wiring board.