Invention Application
- Patent Title: METHOD FOR REMOVAL OF SURFACE FILMS FROM RECLAIM SUBSTRATES
- Patent Title (中): 从回收基板上去除表面膜的方法
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Application No.: US11863050Application Date: 2007-09-27
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Publication No.: US20090088049A1Publication Date: 2009-04-02
- Inventor: Yashraj K. Bhatnagar , Ronald R. Rayandayan , Krishna Vepa
- Applicant: Yashraj K. Bhatnagar , Ronald R. Rayandayan , Krishna Vepa
- Main IPC: B24C1/08
- IPC: B24C1/08

Abstract:
Embodiments of the invention describe a method for reclaiming a substrate by removing surface films with media blasting. A substrate is provided having a surface film. Media blasting is performed on the substrate to remove the surface film from the surface. In one embodiment media blasting removes a film from the substrate top surface. In another embodiment media blasting removes a film from the substrate top surface and side surface.
Public/Granted literature
- US07775856B2 Method for removal of surface films from reclaim substrates Public/Granted day:2010-08-17
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