A process for increasing the strength of pure copper and other fcc matrix alloys. The method is particularly applicable to face-centered-cubic materials that undergo dynamic recovery when strain-hardened at room temperature. A cryogenic strain hardening process is used to create a high strength pure copper or copper+Al2O3 alloy. The strength of the material is substantially increased. However, the loss of conductivity is minimal. In the preferred embodiment, pure copper or a copper alloy is drawn into a wire at a temperature of about 77 K. Dynamic recovery of the material is substantially reduced. With this method, drawn copper wire exhibits a strength level about 45% higher than that achievable by an equivalent room temperature deformation.