发明申请
- 专利标题： SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS
- 专利标题（中）： 固态成像装置，其制造方法和成像装置
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申请号： US12237671申请日： 2008-09-25
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公开(公告)号： US20090090988A1公开(公告)日： 2009-04-09
- 发明人: Yuko OHGISHI
- 申请人： Yuko OHGISHI
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-259501 20071003
- 主分类号： H01L31/102
- IPC分类号： H01L31/102 ; H01L31/18
摘要：
A solid state imaging device includes: a plurality of sensor sections formed in a semiconductor substrate in order to convert incident light into an electric signal; a peripheral circuit section formed in the semiconductor substrate so as to be positioned beside the sensor sections; and a layer having negative fixed electric charges that is formed on a light incidence side of the sensor sections in order to form a hole accumulation layer on light receiving surfaces of the sensor sections.
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