发明申请
- 专利标题: THERMAL EVAPORATION SOURCES FOR WIDE-AREA DEPOSITION
- 专利标题(中): 用于宽区沉积的热蒸发源
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申请号: US12250172申请日: 2008-10-13
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公开(公告)号: US20090095213A1公开(公告)日: 2009-04-16
- 发明人: Robert W. Birkmire , Gregory M. Hanket
- 申请人: Robert W. Birkmire , Gregory M. Hanket
- 申请人地址: US DE Newark
- 专利权人: University of Delaware
- 当前专利权人: University of Delaware
- 当前专利权人地址: US DE Newark
- 主分类号: C23C14/24
- IPC分类号: C23C14/24
摘要:
A thermal evaporation source includes: a crucible configured to contain a volume of evaporant and a vapor space above the evaporant; a manifold body having within it a hollow expansion chamber that is flowably connected to the vapor space via one or more restriction orifices; one or more effusion nozzles flowably connected to the expansion chamber and exiting an outer surface of the thermal evaporation source, the nozzle(s) oriented to direct an evaporant vapor flow out of the source vertically downward, in one or more horizontal directions, or in one or more directions intermediate between horizontal and vertically downward; and a heater capable of heating some or all of the thermal evaporation source to a temperature sufficient to produce the one or more evaporant vapor flows when a vacuum is applied to the thermal evaporation source.
公开/授权文献
- US08986455B2 Thermal evaporation sources for wide-area deposition 公开/授权日:2015-03-24
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