Invention Application
- Patent Title: Module Molding Touch Module
- Patent Title (中): 模块成型触摸模块
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Application No.: US11963796Application Date: 2007-12-22
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Publication No.: US20090101487A1Publication Date: 2009-04-23
- Inventor: Sheng-Pin SU
- Applicant: Sheng-Pin SU
- Priority: TW096139592 20071023
- Main IPC: H01H1/10
- IPC: H01H1/10

Abstract:
An in-mould molding touch module includes a flexible printed circuit having a touch control circuit, and a molding flexible film. The flexible film contains integratedly the flexible printed circuit by an in-mould injecting mode. The flexible film has an outer surface for touch control. The outer surface is configured for being pressed for driving the touch control circuit of the flexible printed circuit to output signals. Therefore, the present touch module is manufactured simply, and has a thin thickness.
Public/Granted literature
- US08779313B2 Module molding touch module Public/Granted day:2014-07-15
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