公开(公告)号：US20090101487A1

公开(公告)日：2009-04-23

申请号：US11963796

申请日：2007-12-22

Applicant: Sheng-Pin SU

Inventor： Sheng-Pin SU

IPC: H01H1/10

CPC classification number: G06F3/0202 ,  B29C45/14639 ,  H01H13/86 ,  H01H13/88 ,  H01H2003/0293 ,  H01H2209/03 ,  H01H2209/052 ,  H01H2209/074 ,  H01H2221/002 ,  H01H2223/002 ,  H01H2225/002 ,  H01H2225/03 ,  H01H2229/044

Abstract: An in-mould molding touch module includes a flexible printed circuit having a touch control circuit, and a molding flexible film. The flexible film contains integratedly the flexible printed circuit by an in-mould injecting mode. The flexible film has an outer surface for touch control. The outer surface is configured for being pressed for driving the touch control circuit of the flexible printed circuit to output signals. Therefore, the present touch module is manufactured simply, and has a thin thickness.

Abstract translation: 模内成型触摸模块包括具有触摸控制电路的柔性印刷电路和成型柔性膜。 柔性膜通过模内注射模式集成在柔性印刷电路上。 柔性膜具有用于触摸控制的外表面。 外表面被配置为被按压以驱动柔性印刷电路的触摸控制电路以输出信号。 因此，本发明的触摸模块简单地制造，并且具有薄的厚度。

公开(公告)号：US20090090000A1

公开(公告)日：2009-04-09

申请号：US11963793

申请日：2007-12-22

Applicant: Sheng-Pin SU ,  Min-Yi Lee

Inventor： Sheng-Pin SU ,  Min-Yi Lee

IPC: H03K17/96 ,  C23C14/34 ,  H05B6/00

CPC classification number: H05K5/0017 ,  H01H2009/0285 ,  Y10T29/4913 ,  Y10T29/49156

Abstract: An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode.

Abstract translation: 模内成型触摸模块包括透明导电基底和模制皮。 透明导电基板具有内表面和外表面。 内表面上形成有电容电极层。 电容电极层是由ITO制成的触摸感测电路，外表面被配置为触摸触摸感测电路。 通过模内注射模式将成型外皮整合成包含透明导电性基材的周边。