发明申请
- 专利标题: LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- 专利标题(中): 激光加工设备和激光加工方法
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申请号: US12256974申请日: 2008-10-23
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公开(公告)号: US20090108173A1公开(公告)日: 2009-04-30
- 发明人: Motoki KAKUI , Kazuo NAKAMAE , Shinobu TAMAOKI
- 申请人: Motoki KAKUI , Kazuo NAKAMAE , Shinobu TAMAOKI
- 申请人地址: JP Osaka
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JPP2007-276773 20071024
- 主分类号: G05B13/02
- IPC分类号: G05B13/02
摘要:
The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.
公开/授权文献
- US08039778B2 Laser processing apparatus and laser processing method 公开/授权日:2011-10-18
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