Invention Application
- Patent Title: ASYMMETRIC DIELECTRIC FILM
- Patent Title (中): 不对称电介质膜
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Application No.: US12256662Application Date: 2008-10-23
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Publication No.: US20090110909A1Publication Date: 2009-04-30
- Inventor: Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant: Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant Address: US DE Wilmington
- Assignee: E. I. DuPont de Nemours and Company
- Current Assignee: E. I. DuPont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B32B27/38
Abstract:
Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.
Information query
