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    Curable composition comprising a di-isoimide, method of curing, and the cured composition so formed
    1.
    发明授权
    Curable composition comprising a di-isoimide, method of curing, and the cured composition so formed 有权
    包含二异氰酸酯的固化组合物，固化方法和如此形成的固化组合物

    公开(公告)号：US08536170B2

    公开(公告)日：2013-09-17

    申请号：US13168047

    申请日：2011-06-24

    申请人： George Elias Zahr

    发明人： George Elias Zahr

    IPC分类号： C07D251/48 ,  C07D251/50 ,  C07D251/52 ,  C07D251/54 ,  A61K31/53 ,  C08K5/18

    CPC分类号： C08G59/4042 ,  C08K5/357 ,  C08L63/00

    摘要： The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.

    摘要翻译： 本发明涉及一种包含芳族二异亚酰亚胺化合物的新型可固化环氧组合物。 二异氰酸酯有效地用作环氧固化中的热活化潜在催化剂，从而提高了保质期，并避免了过早的交联。 还公开了新颖的层压制品和印刷线路板，包括封装的印刷线路板。

    Polyimide cross-linked polymer and shaped article thereof
    3.
    发明授权
    Polyimide cross-linked polymer and shaped article thereof 失效
    聚酰亚胺交联聚合物及其成型制品

    公开(公告)号：US07265181B2

    公开(公告)日：2007-09-04

    申请号：US11177752

    申请日：2005-07-08

    申请人： Pui-Yan Lin ,  George Elias Zahr ,  Govindasamy Paramasivam Rajendran

    发明人： Pui-Yan Lin ,  George Elias Zahr ,  Govindasamy Paramasivam Rajendran

    IPC分类号： C08F8/32

    CPC分类号： C08G73/1014

    摘要： Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.

    摘要翻译： 根据本发明提供的是包含酸酐或部分水解的酸酐官能化聚合物的交联聚合物，其具有低聚聚酰亚胺交联，提供分子尺度的聚合复合物，以及由其制成的成型制品。 在一些实施例中，成形制品特别适用于电子应用。 成型制品的特点是低CTE（热膨胀系数），低介电常数（Dk），低耗散因数（Df），高强度，高模量和高韧性。

    Process and product for making polyamides
    4.
    发明授权
    Process and product for making polyamides 有权
    制造聚酰胺的工艺和产品

    公开(公告)号：US06274697B1

    公开(公告)日：2001-08-14

    申请号：US09469810

    申请日：1999-12-22

    申请人： George Elias Zahr

    发明人： George Elias Zahr

    IPC分类号： C08G6928

    CPC分类号： C08G69/48 ,  C08G69/04 ,  C08G69/16 ,  C08G69/28 ,  C08G69/40

    摘要： Disclosed is a process for modifying polyamide polymers by attaching a substituted or unsubstituted 2-hydroxy-ethyl modifying group to the amide nitrogen atoms and the modified product formed. The process comprises contacting an epoxy containing molecule with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide.

    摘要翻译： 公开了通过将取代或未取代的2-羟基 - 乙基修饰基团连接到酰胺氮原子和形成的改性产物来改性聚酰胺聚合物的方法。 该方法包括将含环氧基的分子与水解的内酰胺或内酰胺的二胺/二酸盐和/或氨基酸接触以形成改性聚酰胺。

    PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A DI-ISOIMIDE, AND PROCESS FOR PREPARING SAME
    6.
    发明申请
    PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A DI-ISOIMIDE, AND PROCESS FOR PREPARING SAME 有权
    由包含DI-正己烷基的粘合层压板包覆的印刷线路板及其制备方法

    公开(公告)号：US20120325535A1

    公开(公告)日：2012-12-27

    申请号：US13168069

    申请日：2011-06-24

    申请人： GEORGE ELIAS ZAHR

    发明人： GEORGE ELIAS ZAHR

    IPC分类号： H05K1/02 ,  H05K13/04 ,  B32B37/12 ,  B32B37/14 ,  B32B37/06 ,  B32B37/10

    CPC分类号： H05K3/386 ,  H05K3/281 ,  H05K2203/1189 ,  Y10T428/31511

    摘要： The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing.

    摘要翻译： 本发明涉及印刷电路板形式的柔性印刷线路板，其中导电元件被包含新型芳族二异亚酰亚胺化合物的环氧粘合剂完全包封。 从而保护导电元件。 柔性印刷电路板容易在100-250℃的温度下固化。然而，在固化之前，通过环氧树脂粘合剂的潜固化特征，印刷电路板的粘合剂组分具有延伸架 生活，避免加工过早固化。